Canteliver Probe Card
MPI Cantilever Probe Card is broadly utilized on gold bump and pad wafer testing for Screen driver, logic, and memory system. MPI’s cantilever probes are definitely the corresponding respond to towards the needs of fine pitch, smaller pad dimension, large pace, much less cleansing, multi-DUT, high pin count, and ultra-minimal leakage specifications. With excellent craftsmanship, impressive architecture and demonstrated methodologies based upon mechanical and electrical simulation/measurement final results, making MPI the top cantilever company around the globe.
FCB Probe Card
The FCB Probe Card is considered the most experienced technologies of buckling beam probe card. It really is aimed to achieve the semiconductor ship manufacture time-to-industry (TTM) and cost of exam (COT) demand from customers. FCB can be a verified solution for several different semiconductor manufacturing checks from early engineering pilot-runs to high quantity producing (HVM). FCB is prepared for unit requiring high signal integrity probing (SI) and/or power integrity probing (PI). Apps incorporate chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB ensures the earth’s greatest General cost-of-possession (COO) for different DUT purposes.
EVS Probe Card
The EVS Probe Card is surely an enhancement over the standard buckling beam probe card. Important attributes are increased current carrying potential (C.C.C.) and reduce balanced Speak to power (BCF), together with General MEMS-like attributes. EVS can easily meet the need of Superior wafer probing. Exact alignment and exceptional planarity Command will be the essential components contributing to steady Get in touch with resistance. With its capacity and overall performance, EVS Probe Card is a great choice for State-of-the-art probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to here desire for at any time finer pitch. It truly is made for smaller sized Al pad, and it is perfect for little pitch software with peripheral and comprehensive array pattern. With specific alignment and greater planarity Handle, Osprey can attain higher productiveness by multi-DUT design and style. The forming wire (FW) sort needle created with MPI’s own micro fabrication system not simply provides significant-good quality performance and also allows uncomplicated needle replacement and shortens retaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle that's suitable for the need of small power probing. It also comes with the opportunity to fulfill large C.C.C. and significant pin counts software. The MEMS system ensures hugely reliable needle properties, as well as Distinctive composition design permits exact alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/